Foamed concrete is considered a green building material, which is porous in nature. As a result, it poses benefits such as being light in self-weight, and also has excellent thermal insulation properties, environmental safeguards, good fire resistance performance, and low cost. Nevertheless, foamed concrete has several disadvantages such as low strength, a large amount of entrained air, poor toughness, and being a brittle material, all of which has restricted its usage in engineering and building construction. Hence, this study intends to assess the potential utilization of polypropylene fibrillated fiber (PFF) in foamed concrete to enhance its engineering properties. A total of 10 mixes of 600 and 1200 kg/m3 densities were produced by the insertion of four varying percentages of PFF (1%, 2%, 3%, and 4%). The properties assessed were splitting tensile, compressive and flexural strengths, workability, porosity, water absorption, and density. Furthermore, the correlations between the properties considered were also evaluated. The outcomes reveal that the foamed concrete mix with 4% PFF attained the highest porosity, with approximately 13.9% and 15.9% for 600 and 1200 kg/m3 densities in comparison to the control specimen. Besides, the mechanical properties (splitting tensile, compressive and flexural strengths) increased steadily with the increase in the PFF percentages up to the optimum level of 3%. Beyond 3%, the strengths reduced significantly due to poor PFF dispersal in the matrix, leading to a balling effect which causes a degraded impact of scattering the stress from the foamed concrete vicinity to another area of the PFF surface. This exploratory investigation will result in a greater comprehension of the possible applications of PFF in LFC. It is crucial to promote the sustainable development and implementation of LFC materials and infrastructures.
This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 µm was produced by varying the dimple depth using different laser scanning repetitions, while the dimple spacing was fixed for each sample at 100 µm. The dimple-microtextured copper substrate was joined with Sn-0.7Cu solder alloy using the reflow soldering process. The solder joints' wettability, microstructure, and growth of its intermetallic compound (IMC) layer were analysed to determine the influence of the dimple-microtextured copper substrate on the performance of the Sn-0.7Cu solder alloy. It was observed that increasing laser scan repetitions increased the dimples' depth, resulting in higher surface roughness. In terms of soldering performance, it was seen that the solder joints' average contact angle decreased with increasing dimple depth, while the average IMC thickness increased as the dimple depth increased. The copper element was more evenly distributed for the dimple-micro-textured copper substrate than its non-textured counterpart.