This research aims to study the effects of the sintering mechanism on the crystallization kinetics when the geopolymer is sintered at different temperatures: 200 °C, 400 °C, 600 °C, 800 °C, 1000 °C, and 1200 °C for a 3 h soaking time with a heating rate of 5 °C/min. The geopolymer is made up of kaolin and sodium silicate as the precursor and an alkali activator, respectively. Characterization of the nepheline produced was carried out using XRF to observe the chemical composition of the geopolymer ceramics. The microstructures and the phase characterization were determined by using SEM and XRD, respectively. The SEM micrograph showed the microstructural development of the geopolymer ceramics as well as identifying reacted/unreacted regions, porosity, and cracks. The maximum flexural strength of 78.92 MPa was achieved by geopolymer sintered at 1200 °C while the minimum was at 200 °C; 7.18 MPa. The result indicates that the flexural strength increased alongside the increment in the sintering temperature of the geopolymer ceramics. This result is supported by the data from the SEM micrograph, where at the temperature of 1000 °C, the matrix structure of geopolymer-based ceramics starts to become dense with the appearance of pores.
The growth and formation of primary intermetallics formed in Sn-3.5Ag soldered on copper organic solderability preservative (Cu-OSP) and electroless nickel immersion gold (ENIG) surface finish after multiple reflows were systematically investigated. Real-time synchrotron imaging was used to investigate the microstructure, focusing on the in situ growth behavior of primary intermetallics during the solid-liquid-solid interactions. The high-speed shear test was conducted to observe the correlation of microstructure formation to the solder joint strength. Subsequently, the experimental results were correlated with the numerical Finite Element (FE) modeling using ANSYS software to investigate the effects of primary intermetallics on the reliability of solder joints. In the Sn-3.5Ag/Cu-OSP solder joint, the well-known Cu6Sn5 interfacial intermetallic compounds (IMCs) layer was observed in each reflow, where the thickness of the IMC layer increases with an increasing number of reflows due to the Cu diffusion from the substrate. Meanwhile, for the Sn-3.5Ag/ENIG solder joints, the Ni3Sn4 interfacial IMC layer was formed first, followed by the (Cu, Ni)6Sn5 IMC layer, where the formation was detected after five cycles of reflow. The results obtained from real-time imaging prove that the Ni layer from the ENIG surface finish possessed an effective barrier to suppress and control the Cu dissolution from the substrates, as there is no sizeable primary phase observed up to four cycles of reflow. Thus, this resulted in a thinner IMC layer and smaller primary intermetallics, producing a stronger solder joint for Sn-3.5Ag/ENIG even after the repeated reflow process relative to the Sn-3.5Ag/Cu-OSP joints.