Fulltext

In Situ Observation of Liquid Solder Alloys and Solid Substrate Reactions Using High-Voltage Transmission Electron Microscopy

Tan XF 1 , Somidin F 1 , McDonald SD 1 , Bermingham MJ 2 , Maeno H 3 , Matsumura S 3 Show all authors , Nogita K 1

Affiliations 

  • 1 Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, The University of Queensland, St. Lucia, QLD 4072, Australia
  • 2 Advanced Materials Processing and Manufacturing (AMPAM), School of Mechanical and Mining Engineering, The University of Queensland, St. Lucia, QLD 4072, Australia
  • 3 The Ultramicroscopy Research Center, Kyushu University, Fukuoka 819-0395, Japan
Materials (Basel), 2022 Jan 10;15(2).
PMID: 35057226 DOI: 10.3390/ma15020510

Abstract

The complex reaction between liquid solder alloys and solid substrates has been studied ex-situ in a few studies, utilizing creative setups to "freeze" the reactions at different stages during the reflow soldering process. However, full understanding of the dynamics of the process is difficult due to the lack of direct observation at micro- and nano-meter resolutions. In this study, high voltage transmission electron microscopy (HV-TEM) is employed to observe the morphological changes that occur in Cu6Sn5 between a Sn-3.0 wt%Ag-0.5 wt%Cu (SAC305) solder alloy and a Cu substrate in situ at temperatures above the solidus of the alloy. This enables the continuous surveillance of rapid grain boundary movements of Cu6Sn5 during soldering and increases the fundamental understanding of reaction mechanisms in solder solid/liquid interfaces.

* Title and MeSH Headings from MEDLINE®/PubMed®, a database of the U.S. National Library of Medicine.

Similar publications