Dispersibility of nanoparticles is the key problem in nanotechnology industries, and thus warrants
attention on the techniques of dispersion. This review paper presents dispersibility of treated nanoparticles
in polymer resin. Dispersibility of nanoparticles in polymer media is crucial in order to enhance the
mechanical and thermal properties of nanocomposite. This paper concentrates on several preparations
on how to incorporate nanoparticles in polymer to overcome the problem described in this review. A
few techniques are discussed in this paper such as by using ultra sonication or even directly mixing
nanoparticles into polymer matrix.
The formation of intermetallic compound (IMC) layer at the interfaces of pad finishes has been studied.
The growth of IMC layer as a reflow process and its properties were also discussed. In this study, solder
alloy SAC237 (Sn: 99 wt.%, Ag: 0.3 wt.%, Cu: 0.7 wt.%), reinforced with 0.01 wt.% Multi-Walled
Carbon Nanotubes (MWCNTs), was mixed to form a composite solder paste and soldered on Electroless
Nickel Immersion Gold (ENIG) and Immersion Tin (ImSn) pad finishes. Reflow process was conducted
in oven with specific reflow profile. The growth and properties of IMC layer were analysed using optical
microscope with image analyser. Results showed that the thickness of IMC layer for ENIG and ImSn
were 1.49 and 2.51 µm, respectively. Floating IMC and voids within the solder bulk and IMC layer
were also identified in the samples. In addition, the measured wetting angle for ENIG and ImSn were
16.21° and 34.32°, respectively.
In the recent years, electronic packaging provides significant research and development challenges
across multiple disciplines such as performance, materials, reliability, thermals and interconnections.
New technologies and techniques frequently adopted can be implemented in soldering alloys of
semiconductor sectors in terms of optimisation. Wetting contact angle or wettability of solder alloys
is one of the important factors which has got the attention of scholars. Hence in this study, due to the
remarkable similarity over classical solder alloys (Pb-Sn), Bi-Ag solder was investigated. Data were
collected through the effects of aging time variation and different weight percentages of Ag in solder
alloys. The contact angle of the alloys with Cu plate was measured by optical microscopy. Artificial
neural networks (ANNs) were applied on the measured datasets to develop a numerical model for further
simulation. Results of the experiments and simulations showed that the coefficient of determination (R2
)
is around 0.97, which signifies that the ANN set up is appropriate for the evaluation.