In the recent years, electronic packaging provides significant research and development challenges
across multiple disciplines such as performance, materials, reliability, thermals and interconnections.
New technologies and techniques frequently adopted can be implemented in soldering alloys of
semiconductor sectors in terms of optimisation. Wetting contact angle or wettability of solder alloys
is one of the important factors which has got the attention of scholars. Hence in this study, due to the
remarkable similarity over classical solder alloys (Pb-Sn), Bi-Ag solder was investigated. Data were
collected through the effects of aging time variation and different weight percentages of Ag in solder
alloys. The contact angle of the alloys with Cu plate was measured by optical microscopy. Artificial
neural networks (ANNs) were applied on the measured datasets to develop a numerical model for further
simulation. Results of the experiments and simulations showed that the coefficient of determination (R2
)
is around 0.97, which signifies that the ANN set up is appropriate for the evaluation.