Wettability of Sn-3.0Ag-0.5Cu Solder Reinforced with TiO2 and Al2O3 Nanoparticles at Different Reflow Times

This study investigated the influence of reinforcing 0.50 wt.% of titanium oxide (TiO2) and aluminium oxide (Al2O3) nanoparticles on the wettability performance of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy. The thermal properties of the SAC305 nanocomposite solder are comparable with thos of an SAC305 solder with a peak temperature window within a range of 240 to 250 °C. The wetting behaviour of the non-reinforced and reinforced SAC305 nanocomposite solder was determined and measured using the contact angle and spreading area and the relationships between them were studied. There is an increment in the spreading area (5.6 to 7.32 mm) by 30.71% and a reduction in the contact angle (26.3 to 18.6°) by 14.29% with an increasing reflow time up to 60 s when reinforcing SAC305 solder with 0.50 wt.% of TiO2 and Al2O3 nanoparticles. The SAC305 nanocomposite solder has a better wetting performance compared with the SAC305 solder. As the reflow time increased, the spreading area increased and the contact angle decreased, which restricted intermetallic compound growth and thus improved wettability performance.