Since its invention, polyimide (PI) has been widely used in micro-electro-mechanical system (MEMS) devices. For fabrication, the PI membrane, PI-2723 HD-Microsystems was used as the membrane material due to its Young's modulus of 2.7 GPa and its film thickness could easily be controlled by changing the speed of the spin coater system. The application PI as membrane structure on silicon wafers therefore gave a much better mechanical performance then conventional membranes made of silicon dioxide (SiO2) or silicon nitride (Si3N4) layers. The fabrication of PI membrane was the same as for SiO2 and Si3N4 membranes; the basic step was to etch a side of the silicon wafer using wet anisotropic etching. This paper proposes an effective process for fabrication of PI membrane with f ast and little supervision. In this process, a dual step process was wet anisotropic etching of single crystal silicon using pottasium hydroxyl (KOH) with different concentrations and temperature processes. For the first process, 45% KOH under boiling temperature was used to etch at least 90%–95% of the silicon. In the second process, the silicon was submerged in 45% KOH with temperature at 70ºC–80ºC to etch away the residual silicon until a clean and transparent PI membrane was achieved. Using this method, the fabrication of PI membrane could be generated fast.
In this study, we demonstrated the fabrication of the concave conic shape microneedle with the aid of COMSOL Multiphysics simulation. The stress and buckling of the microneedle structure were simulated by applying various loads ranging from 50 to 800 g perpendiculars to the tip in order to predict the occurrence of microneedles structure deformation. The simulation study indicated that the surface buckling deformation does not occur to the microneedle structure with the increment of the load. The microneedles with dimensions of height and diameter tip ranging from 60 to 100 μm and 1 to 4 μm, respectively had been fabricated via an etching process in a mixture of hydrofluoric acid, nitric acid, and acetic acid. Three optimized microneedles but different in the structures were fabricated via the acidic etching process. The reproducibility of 3 different microneedle structures was 15, 20, and 60%, respectively. Stress and buckling analyses of the fabricated microneedles were further carried out on the rat skin. The obtained experimental results show promising applications for the deep dermis, stratum corneum to epidermis layer penetration.