Affiliations 

  • 1 Research Center for Sustainable Process Technology (CESPRO), Faculty of Engineering and Built Environment, Universiti Kebangsaan Malaysia, Bangi 43600, Selangor, Malaysia
Materials (Basel), 2023 Feb 22;16(5).
PMID: 36902909 DOI: 10.3390/ma16051793

Abstract

As additive manufacturing continues to evolve, there is ongoing discussion about ways to improve the layer-by-layer printing process and increase the mechanical strength of printed objects compared to those produced by traditional techniques such as injection molding. To achieve this, researchers are exploring ways of enhancing the interaction between the matrix and filler by introducing lignin in the 3D printing filament processing. In this work, research has been conducted on using biodegradable fillers of organosolv lignin, as a reinforcement for the filament layers in order to enhance interlayer adhesion by using a bench-top filament extruder. Briefly, it was found that organosolv lignin fillers have the potential to improve the properties of polylactic acid (PLA) filament for fused deposition modeling (FDM) 3D printing. By incorporating different formulations of lignin with PLA, it was found that using 3 to 5% lignin in the filament leads to an improvement in the Young's modulus and interlayer adhesion in 3D printing. However, an increment of up to 10% also results in a decrease in the composite tensile strength due to the lack of bonding between the lignin and PLA and the limited mixing capability of the small extruder.

* Title and MeSH Headings from MEDLINE®/PubMed®, a database of the U.S. National Library of Medicine.