In this work, the dielectrophoretic force (F(DEP)) response of Aluminium Microelectrode Arrays with tapered profile is investigated through experimental measurements and numerical simulations. A standard CMOS processing technique with a step for the formation of a tapered profile resist is implemented in the fabrication of Tapered Aluminium Microelectrode Arrays (TAMA). The F(DEP) is investigated through analysis of the Clausius-Mossotti factor (CMF) and cross-over frequency (f(xo)). The performance of TAMA with various side wall angles is compared to that of microelectrodes with a straight cut sidewall profile over a wide range of frequencies through FEM numerical simulations. Additionally, electric field measurement (EFM) is performed through scanning probe microscopy (SPM) in order to obtain the region of force focus in both platforms. Results showed that the tapered profile microelectrodes with angles between 60° and 70° produce the highest electric field gradient on the particles. Also, the region of the strongest electric field in TAMA is located at the bottom and top edge of microelectrode while the strongest electric field in microelectrodes with straight cut profile is found at the top corner of the microelectrode. The latter property of microelectrodes improves the probability of capturing/repelling the particles at the microelectrode's side wall.
Atomic force microscopes (AFM) as one of the scanning probe microscopy (spm) modes have become useful tools, not only for observing surface morphology and nanostructure topography but also for fabrication of various nanostructures itself. In this work, silicon oxide (SiOx) patterns were formed on Si(100) surface by means of AFM anodization, where a non-contact mode used to oxidize Si wafer at the nanoscale size. The oxide patterns could serve as masks for the chemical etching of Si surface in alkaline solution in order to create the Si nanodots. A special attention is paid to finding relations between the size of dots and operational parameters as tip bias voltage and tip writing speed Dot arrays with 10 nm high and less than 50 nm in diameter have been successfully fabricated. The ability to control oxidation and scanning speed can be utilized in fabrication of complex nanostructures and make scanning probe lithography (SPL) as a very promising lithographic technique in nanoelectronic devices, nanophotonics and other high-tech areas.
Photovoltaic module backsheets are characterized according to their thermal, optical, mechanical, and technical properties. This work introduces new fabricated backsheets for PV modules using polyvinylidene fluoride (PVDF) reinforced with short sugar palm fiber (SSPF) composites. The preparation of composites undergoes multiple phases of fabrication. Thermal, optical, and technical investigations of their properties were conducted. Fourier transform infrared spectroscopy (FTIR), Raman spectroscopy, in-situ scanning probe microscopy (SPM), dynamic mechanical analysis (DMA), thermal mechanical analysis (TMA), thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), and prolonged technical testing were accomplished to expansively understand the complex behavior of composites under various conditions. The optical properties of PV backsheets are critical components in determining the reflectance, absorbance, and transmittance of light. The PVDF-SSPF composites exhibited exceptional compatibility and thermal stability, further revealing a homogenous composite structure with enhanced interfacial bonding between the short fiber and polymer matrix.