Affiliations 

  • 1 Department of Chemical Engineering, School of Chemical and Materials Engineering (SCME), National University of Sciences and Technology (NUST), Sector H-12, Islamabad, Pakistan
  • 2 Department of Chemical Engineering, School of Chemical and Materials Engineering (SCME), National University of Sciences and Technology (NUST), Sector H-12, Islamabad, Pakistan. Electronic address: sarah.farrukh@scme.nust.edu.pk
  • 3 National Engineering and Scientific Commission (NESCOM), Islamabad, Pakistan
  • 4 Department of Chemical Engineering, University of Engineering and Technology (UET), Peshawar, 25000, Pakistan
  • 5 Department of Petroleum Engineering, School of Engineering, Asia Pacific University of Technology and Innovation, 57000, Kuala Lumpur, Malaysia
  • 6 Chemical Engineering Department, COMSATS University Islamabad (CUI), Lahore Campus, Lahore, Punjab, 54000, Pakistan
  • 7 Department of Chemical Engineering, Universiti Teknologi PETRONAS, Seri Iskandar, Perak, 32610, Malaysia
  • 8 Chemical Engineering Department, COMSATS University Islamabad (CUI), Lahore Campus, Lahore, Punjab, 54000, Pakistan; Sustainable Process Integration Laboratory, SPIL, NETME Centre, Faculty of Mechanical Engineering, Brno University of Technology, VUT Brno, Technická 2896/2, 616 69, Brno, Czech Republic
  • 9 Department of Chemical and Environmental Engineering, Faculty Science and Engineering, University of Nottingham, Malaysia, 43500, Semenyih, Selangor Darul Ehsan, Malaysia
  • 10 Faculty of Applied Sciences, UCSI University, UCSI Heights, 56000, Cheras, Kuala Lumpur, Malaysia
  • 11 Department of Chemistry, College of Science, King Khalid University, Abha, 61413, P. O. Box 9004, Saudi Arabia
  • 12 Department of Chemical and Environmental Engineering, Faculty Science and Engineering, University of Nottingham, Malaysia, 43500, Semenyih, Selangor Darul Ehsan, Malaysia. Electronic address: PauLoke.Show@nottingham.edu.my
Environ Res, 2022 Apr 01;205:112402.
PMID: 34838569 DOI: 10.1016/j.envres.2021.112402

Abstract

The emerging growth of the electronic devices applications has arisen the serious problems of electromagnetic (EM) wave pollution which resulting in equipment malfunction. Therefore, polymer-based composites have been considered good candidates for better EMI shielding due to their significant characteristics including, higher flexibility, ultrathin, lightweight, superior conductivity, easy fabrication processing, environmentally friendly, corrosion resistive, better adhesion with physical, chemical and thermal stability. This review article focused on the concept of the EMI shielding mechanism and challenges with the fabrication of polymer-based composites. Subsequently, recent advancements in the polymer composites applications have been critically reviewed. In addition, the impact of polymers and polymer nanocomposites with different fillers such as organic, inorganic, 2D, 3D, mixture and hybrid nano-fillers on EMI shielding effectiveness has been explored. Lastly, future research directions have been proposed to overcome the limitations of current technologies for further advancement in EMI shielding materials for industrial applications. Based on reported literature, it has been found that the low thickness based lightweight polymer is considered as a best material for excellent material for next-generation electronic devices. Optimization of polymer composites during the fabrication is required for better EMI shielding. New nano-fillers such as functionalization and composite polymers are best to enhance the EMI shielding and conductive properties.

* Title and MeSH Headings from MEDLINE®/PubMed®, a database of the U.S. National Library of Medicine.