Lead-free solder paste printing processes account for the majority of assembly defects in the electronic manufacturing industry. In the stencil printing process, the solder paste must be able to withstand low and high shear rates which result in continuous structural breakdown and build-up. This study investigated the effect of the addition of nickel and platinum powders to the thixotropic behaviour of lead-free Sn/Ag/Cu solder pastes using the structural kinetic model. A hysteresis loop test and constant shear test were utilized to investigate the thixotropic behaviour of the pastes using parallel plate rheometry at 25ºC. In this study, the shear rates were increased from 0.01 s–1 to 10 s–1 and the second curve was a result of decreasing the shear rate from 10 s–1 to 0.01 s–1. For the constant shear test, the samples were subjected to five different shear rates of 0.01s–1, 0.1s–1, 1s–1, 10s–1 and 100s–1. The constant shear rate test was designed to study the structural breakdown and build-up of the paste materials. From this investigation, the hysteresis loop test was shown to be an effective test method to differentiate the extent of structural recovery in the solder pastes. All the pastes showed a high degree of shear thinning behaviour with time. This might be due to the agglomeration of particles in the flux that prohibited paste flow under low shear rate. The action of high shear rate would break the agglomerates into smaller pieces which facilitated the flow of pastes, thus viscosity was reduced at high shear rate.